Technical core advantages
Focusing on new transparent display technology for curved surfaces
Professional creation of visual art innovation projects
Save 1/2 electricity compared to similar products
Module/M ² Weight 165G
Base material patent Thickness ≤ 2.5mm
Welding tension ≥ 5.5kg
High Display Index
Permeability ≥ 75%
Inverted bare crystal
Green and energy-saving, full color highlight
Large size wafers (20 * 22mil)
Special PET material
Product advantages
Hengyunlian Technology adopts the internationally leading Flip Chip Bare Crystal flip chip Package packaging technology, which has high color rendering index, low power consumption, and low heat sink, ensuring stable and reliable product performance.
Ultra thin and ultra light
The thickness of the flexible screen is less than 2mm, and the weight is only 0.5-1.5kg/㎡. No need for steel frame structure, no need to change the appearance of the building, effectively reducing transportation and installation costs.
Strong flexibility
Strong flexibility, can adhere to any curvature, and has good physical flexibility. Curved screens, irregular screens, and straight screens can all be easily achieved, with a static bending curvature of 5cm.
Specification customization
Seamless splicing display screen based on the required display structure shape, invisible installation, integrated with the environmental structure, can be flat or curved.
Invisible display
The luminescent chip adopts a micrometer level light source. No grid, no grating, no lag high-speed digital image transmission, grayscale level 16Bit, high refresh rate.
Equidistant imaging
In terms of display effect, it has high grayscale, high chromaticity, high refresh rate, and high brightness characteristics. The luminescent chip adopts a micrometer level light source, which has strong color restoration ability.
Extra large viewing angle
The full range view can reach up to 160 degrees, with a wide field of view, smooth playback, realistic colors, and the ability to achieve full screen dual sided synchronous playback.
Super power-saving
The company adopts internationally leading scanning drive technology and centralized management matrix address allocation design, making FTF LED products consume 50% of the power of traditional display screens.
Convenient installation
According to the display environment, methods such as mounting, lifting, embedding, clamping, and supporting can be used for quick construction.
Save time and effort
Due to the use of modular boxes, not only installation efficiency is improved, but also construction labor costs and installation processes are effectively reduced, ensuring safe production.
柔性薄膜透明显示屏 Flexible film transparent display screen
Forever imitated, never surpassed, reliable and safe, durable, ultra power-saving, and technologically advanced globally
Car level plug-in centralized control drive board (front)
HYL FTF LED
A unique domestic manufacturer of high-end flexible transparent film display screens
Modified PET High Permeability Substrate
Copper sinking epitaxial double-sided coating circuit
Laser Etching Wiring
Aerospace grade SMT mounting process
Flip LED luminescent chip
Car level plug-in centralized control drive board (opposite)
Patent Technology Series
Exclusivity characteristics of product modules
To ensure the stable and reliable operation of the product, Hengyunlian Technology FTF LED series display products refuse to use the "light drive integration" luminous chip.
Any surface
Any surface
Durable and energy-saving
Durable and energy-saving
seamless splicing
seamless splicing
Infinite Colors
Infinite Colors
Adopting patented technology of fully modular contactless seamless four-sided splicing structure, various irregular surfaces are continuously spliced in all directions without seams.
The flip chip level light source configuration ensures realistic color reproduction on curved screens, saving energy and electricity.
The use of vehicle grade seismic resistant concealed connectors on the back side ensures reliable rotation of the hexagonal transparent screen.
Hengyunlian: Conventional chips are stable and reliable
The FTF LED series products of Hengyunlian Technology use conventional RGB light-emitting chips, with low internal wiring, low power consumption, low temperature rise, and high light efficiency. From the right figure, it can be seen that the internal structure of the lamp bead has only three bonding leads, and the large-sized chip packaging greatly improves light efficiency, reduces heat sink, saves power supply, and ensures the stable and reliable operation of the light-emitting body. The LED used in the Hengyunlian Technology series products strictly operates within the typical range of full color LED specifications, without overload, heat generation, and strong color reproduction ability. It is currently a unique proprietary intellectual property display solution.
230 ℃ high-temperature resistant modified PET high permeability substrate
Double sided copper epitaxial coating conductive layer
Laser Etching AOI Circuit Detection
12mil aerospace grade silver nickel copper plated double-sided wiring
28milx55mil flip chip level light source
Full module contactless seamless four sided splicing
The entire module has no IC heat source and no temperature rise
The world's lowest electricity consumption per unit area
Luminescent body and substrate have the highest global tensile force
Vehicle standard seismic resistant concealed connector on the back side
Enlarged view of wick
Market: Frequent failure of light drive integration
The common luminescent chip used in the market for flexible transparent film display screens is composed of a driver IC embedded inside the lamp core and more than ten additional wires, resulting in the superposition of IC temperature rise and chip temperature rise, resulting in a surge in screen temperature. This not only results in high power consumption, temperature rise, and low light efficiency, but also directly affects the stable and reliable operation of the screen, leading to increased LED light decay and shortened lifespan. In the event of environmental humidity, temperature, and acid, alkali, and salt impurities invading the internal lead group of the chip, It is highly prone to open circuits and short circuits, leading to the failure of luminous points. Although there are "breakpoint continuation" technical remedies, it still cannot guarantee the reliable and stable operation of the display screen. So, the so-called "light drive integration" display scheme is a congenital deficiency.
Soft glass fiber/polyester film copper clad substrate
Single sided copper epitaxial coating conductive layer
Film exposure etching circuit detection
Millimeter grade copper plated single sided wiring
6milx8mil integrated IC packaging RGB light source
Full module with contact triple splicing
The temperature of the module's entire polymerization heat source increases
Equal area module with high power consumption and poor heat dissipation
Low adhesion between the luminescent body and the substrate
External reinforced conventional compression connector
Enlarged view of wick
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Contact number： +86 136 0266 7655
R&D Base: 808, Building 1, Zhongcheng Future Industrial Park, Hangcheng Zhigu, Bao'an, Shenzhen
400 meters northeast of Pingsha Electronic & Electrical Industrial Park, Sanhu Avenue, Jinwan District, Zhuhai City
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