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技术核心优势 Technical core advantages

专注新型曲面透明显示技术

Focusing on new transparent display technology for curved surfaces

专业打造视觉艺术创新工程

Professional creation of visual art innovation projects

比同类产品节电1/2

Save 1/2 electricity compared to similar products

模组/m² 重量165g

Module/M ² Weight 165G

基材专利

厚度≤2.5mm

Base material patent Thickness ≤ 2.5mm

贴焊拉力≥5.5kg

Welding tension ≥ 5.5kg

高显示指数

High Display Index

通透率≥75%

Permeability ≥ 75%

倒装裸晶

Inverted bare crystal

绿色节能，全彩高亮

Green and energy-saving, full color highlight

大尺寸晶元 (20*22mil)

Large size wafers (20 * 22mil)

专用PET材料

Special PET material

产品优势 Product advantages

恒云联科技采用国际领先的 Flip Chip Bare Crystal 倒装芯片 Chip Package 封装技术，显色指数高、功耗小、热沉低，使产品性能稳定可靠。

Hengyunlian Technology adopts the internationally leading Flip Chip Bare Crystal flip chip Package packaging technology, which has high color rendering index, low power consumption, and low heat sink, ensuring stable and reliable product performance.

超薄超轻

Ultra thin and ultra light

柔性屏厚度小于2mm，重量仅0.5~1.5kg/㎡。不需要钢架结构，不需要更改大楼外观，有效降低运输及安装成本。

The thickness of the flexible screen is less than 2mm, and the weight is only 0.5-1.5kg/㎡. No need for steel frame structure, no need to change the appearance of the building, effectively reducing transportation and installation costs.

柔韧性强

Strong flexibility

柔韧性强，可贴任意弧度，物理柔韧性好。曲屏、异形屏、直屏都可以轻松实现，静态弯曲曲率达5cm。

Strong flexibility, can adhere to any curvature, and has good physical flexibility. Curved screens, irregular screens, and straight screens can all be easily achieved, with a static bending curvature of 5cm.

规格定制

Specification customization

根据所需显示结构形状实现的无缝拼接显示画面，隐形安装，与环境结构融为一体，即可平面亦可曲面。

Seamless splicing display screen based on the required display structure shape, invisible installation, integrated with the environmental structure, can be flat or curved.

隐形显示

Invisible display

发光晶片采用微米级发光源。无网格、无光栅、无卡顿高速数字图像传输，灰度等级16Bit，刷新率高。

The luminescent chip adopts a micrometer level light source. No grid, no grating, no lag high-speed digital image transmission, grayscale level 16Bit, high refresh rate.

等距成像

Equidistant imaging

在显示效果上，具有高灰度、高色彩度、高刷新率高亮度特性，发光芯片采用微米级发光源，色彩还原能力强。

In terms of display effect, it has high grayscale, high chromaticity, high refresh rate, and high brightness characteristics. The luminescent chip adopts a micrometer level light source, which has strong color restoration ability.

超大视角

Extra large viewing angle

全方位视域最高达160度，视野开阔，播放流畅，色彩逼真，可实现整屏双面同步播放。

The full range view can reach up to 160 degrees, with a wide field of view, smooth playback, realistic colors, and the ability to achieve full screen dual sided synchronous playback.

超级省电

Super power-saving

公司采用国际领先扫描驱动技术，集控行管矩阵地址分配设计，使FTF LED产品耗电是传统显示屏的50%。

The company adopts internationally leading scanning drive technology and centralized management matrix address allocation design, making FTF LED products consume 50% of the power of traditional display screens.

安装便捷

Convenient installation

可根据显示环境采用贴装、吊装、嵌入、夹装、撑装等方式快捷施工。

According to the display environment, methods such as mounting, lifting, embedding, clamping, and supporting can be used for quick construction.

省时省力

Save time and effort

由于采用了模块化箱体，不仅提高安装效率，还有效减少了施工人力成本和安装流程及保障安全生产。

Due to the use of modular boxes, not only installation efficiency is improved, but also construction labor costs and installation processes are effectively reduced, ensuring safe production.

柔性薄膜透明显示屏 Flexible film transparent display screen

永远被模仿·从未被超越·可靠又安全·耐用超省电·科技全球先

Forever imitated, never surpassed, reliable and safe, durable, ultra power-saving, and technologically advanced globally

车载级插拔式集控驱动板（正面）

Car level plug-in centralized control drive board (front)

HYL FTF LED

独树一帜的国内高端柔性透明薄膜显示屏制造商

A unique domestic manufacturer of high-end flexible transparent film display screens

改性PET高透基板

Modified PET High Permeability Substrate

沉铜外延双面镀膜电路

Copper sinking epitaxial double-sided coating circuit

激光镭射蚀刻布线

Laser Etching Wiring

航天级SMT贴片工艺

Aerospace grade SMT mounting process

倒装LED发光芯片

Flip LED luminescent chip

车载级插拔式集控驱动板（反面）

Car level plug-in centralized control drive board (opposite)

专利技术系列 Patent Technology Series

产品模组排他性特点

Exclusivity characteristics of product modules

为确保产品稳定可靠运行，恒云联科技FTF LED系列显示产品拒绝使用“灯驱合一”发光芯片。

To ensure the stable and reliable operation of the product, Hengyunlian Technology FTF LED series display products refuse to use the "light drive integration" luminous chip.

任意曲面

Any surface

任意曲面

Any surface

耐用省电

Durable and energy-saving

耐用省电

Durable and energy-saving

无缝拼接

seamless splicing

无缝拼接

seamless splicing

色彩无限

Infinite Colors

色彩无限

Infinite Colors

采用全模组无触点无缝四边拼接结构专利技术，让各种异形曲面全方位无拼缝连续拼接。

Adopting patented technology of fully modular contactless seamless four-sided splicing structure, various irregular surfaces are continuously spliced in all directions without seams.

倒装芯片级光源配置确保曲面屏色彩还原逼真，节能省电。

The flip chip level light source configuration ensures realistic color reproduction on curved screens, saving energy and electricity.

选用车规级抗震背侧隐蔽连接器让六方体透明屏旋转可靠。

The use of vehicle grade seismic resistant concealed connectors on the back side ensures reliable rotation of the hexagonal transparent screen.

恒云联常规芯片稳定可靠 Hengyunlian: Conventional chips are stable and reliable

恒云联科技FTF LED系列产品采用常规RGB发光芯片，灯芯内部打线少功耗小、温升低、光效高，从右图可以看出灯珠内部的结构，只有三条键合引线，大尺寸芯片封装，大幅度提升了光效，降低了热沉，节省了供电，有利保障了发光体工作稳定可靠。恒云联科技系列产品选用的发光体，严格运行在全彩LED《规格书》典型值范围内，不过载、不发热、显色指数高色彩还原能力强，是目前独树一帜的自有知识产权显示方案。

The FTF LED series products of Hengyunlian Technology use conventional RGB light-emitting chips, with low internal wiring, low power consumption, low temperature rise, and high light efficiency. From the right figure, it can be seen that the internal structure of the lamp bead has only three bonding leads, and the large-sized chip packaging greatly improves light efficiency, reduces heat sink, saves power supply, and ensures the stable and reliable operation of the light-emitting body. The LED used in the Hengyunlian Technology series products strictly operates within the typical range of full color LED specifications, without overload, heat generation, and strong color reproduction ability. It is currently a unique proprietary intellectual property display solution.

230℃耐高温改性PET高透基板

230 ℃ high-temperature resistant modified PET high permeability substrate

双面沉铜外延镀膜导电层

Double sided copper epitaxial coating conductive layer

激光镭射蚀刻AOI电路检测

Laser Etching AOI Circuit Detection

12mil航天级银镍铜镀双面布线

12mil aerospace grade silver nickel copper plated double-sided wiring

28milx55mil倒装芯片级光源

28milx55mil flip chip level light source

全模组无触点无缝四边拼接

Full module contactless seamless four sided splicing

模组整版无IC热源无温升

The entire module has no IC heat source and no temperature rise

等单位面积耗电全球最低

The world's lowest electricity consumption per unit area

发光体与基板拉力全球最高

Luminescent body and substrate have the highest global tensile force

车规级抗震背侧隐蔽连接器

Vehicle standard seismic resistant concealed connector on the back side

灯芯放大图

Enlarged view of wick

市场：灯驱合一故障频发 Market: Frequent failure of light drive integration

市场上常见的柔性透明薄膜显示屏用发光芯片是灯芯内部均嵌入驱动IC、增加十余条打线构成,致使IC温升和芯片温升叠加，屏体温度飙升,不仅功耗大、温升高、光效少,还直接影响到屏体稳定可靠地工作，导致LED光衰加剧，寿命缩短，遇有环境湿度、温度、酸碱盐杂质侵入芯片内部引线组，极易发生开路和短路，导致发光点失效,虽有“断点续传”技术补救措施，仍无法保障显示屏可靠稳定工作。所以，所谓“灯驱合一”显示方案是先天性不足的缺陷。

The common luminescent chip used in the market for flexible transparent film display screens is composed of a driver IC embedded inside the lamp core and more than ten additional wires, resulting in the superposition of IC temperature rise and chip temperature rise, resulting in a surge in screen temperature. This not only results in high power consumption, temperature rise, and low light efficiency, but also directly affects the stable and reliable operation of the screen, leading to increased LED light decay and shortened lifespan. In the event of environmental humidity, temperature, and acid, alkali, and salt impurities invading the internal lead group of the chip, It is highly prone to open circuits and short circuits, leading to the failure of luminous points. Although there are "breakpoint continuation" technical remedies, it still cannot guarantee the reliable and stable operation of the display screen. So, the so-called "light drive integration" display scheme is a congenital deficiency.

软性玻纤/聚脂薄膜覆铜基板

Soft glass fiber/polyester film copper clad substrate

单面沉铜外延镀膜导电层

Single sided copper epitaxial coating conductive layer

菲林曝光蚀刻电路检测

Film exposure etching circuit detection

毫米级铜镀单面布线

Millimeter grade copper plated single sided wiring

6milx8mil集成IC封装RGB光源

6milx8mil integrated IC packaging RGB light source

全模组有触点三边拼接

Full module with contact triple splicing